RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Product Display
Absorption shielding
Double sided adhesive conductive cloth
Earphone dust screen
Graphite sheet
Camera sealing foam
Camera lens backing adhesive
Omnidirectional conductive sponge
Horn dust net
Main Business
· Comprehensive Services for Functional Devices
Paste
Protection
Electric conduction
Isolation
Heat dissipation
Shield
- Focusing on providing professional precision die-cutting production and services for brand terminal manufacturers in the field of 3C products (Computer, Communication, Consumer Electronics);
- According to the customer's automation requirements, through the mold, mica, aerogel, double-sided adhesive PORON、 Insulation, conductive fabric, heat dissipation/insulation and other raw materials are punched and processed into the shape required by customers.
About Us
RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED was established in 2025 with a registered capital 1000000 US dollars and a production plant area of 2720 square meters. Business scope: Focusing on providing professional precision die-cutting production and services for brand terminal manufacturers in the 3C product (Computer, Communication, Consumer Electronics) field; The technical process includes CCD detection, laser, slitting, slitting, cutting, bonding, nesting, die-cutting, hot pressing, and full inspection.
RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
2025
Company Established
50
Registered capital (USD 10000)
2720
Floor Area (㎡)
News and Information
Key Account
Main ODM customers
Serve
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