RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED was established in 2025 with a registered capital 1000000 US dollars and a production plant area of 2720 square meters. Business scope: Focusing on providing professional precision die-cutting production and services for brand terminal manufacturers in the 3C product (Computer, Communication, Consumer Electronics) field; The technical process includes CCD detection, laser, slitting, slitting, cutting, bonding, nesting, die-cutting, hot pressing, and full inspection.