RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
About Us
RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED. was established in 2025 with a registered capital 1000000 US dollars and a production plant area of 2720 square meters. Business scope: Focusing on providing professional precision die-cutting production and services for brand terminal manufacturers in the 3C product (Computer, Communication, Consumer Electronics) field; The technical process includes CCD detection, laser, slitting, slitting, cutting, bonding, nesting, die-cutting, hot pressing, and full inspection.
RUNTO INTERNATIONAL SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
2025
Company Established
50
Registered capital (USD 10000)
2720
Floor Area (㎡)
Development History
Enterprise Honor
Patents: 6 invention patents, 11 utility model patents, 8 software copyrights, a total of 25 patents

Corporate Vision

To become a leading technology company in the industry and a trusted enterprise by customers

Business philosophy

Integrity management, continuous innovation, and green production

Corporate Mission

Create value for customers, generate profits for the enterprise, and create benefits for employees

Copyright © 2025 Copyright Rundao Technology Co., Ltd
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